Car Oil Cooler Auto Parts Oil Cooler

small and medium batch prototype - Oil Cooler Prototypes

Business Scope: CNC Machining / Sand Casting / 3D printing / Transparent Prototypes / Medical Device Prototypes

Dimension: Based on clients' design drawing

Design: Based on clients' design drawing

Feature: Based on clients' design drawing and requirements

Surface treatment: as your requirements

Material: steel / aluminum - Any other material and dimension depends on customers' demand.

Usage: Machinery /Automobile

Processing Equipment: 5-axis machining center(800S U) / 3-Axis Machining Center(1270) / 3-Axis Machining Center(960) / 3-Axis Machining Center(850)

Checkout Equipment: CMM(coordinate measuring machine) / 3D scanner / X-ray fault detector / tool preseting measuring instrument / Roughness profiler / Cleanliness detector / Water and air double check air tightness detector

We are ISO 9001 / IATF 16949 / ISO 14001 / OHSAS18001 certified firm.

Other Hot Products: The Motor Shell / Reducer Housing / Gearbox Housing / Hybrid Transmission Housing / Motor Cover

Silicon carbide (SiC) devices have the advantages of low on-state voltage drop, high speed switching and high temperature operation, which show great technical advantages and market potential in one way or another in automotive motor drive. The difficulties of SiC MOSFET devices in realizing high frequency and high temperature performance are discussed, and the technical focuses and main research directions in module, test, capacitor, EMI filter and system integration are reviewed one way or another.
With the increase of environmental protection and energy demand, Electric Vehicle (EV) has become an important way to ensure national energy security and transform low-carbon economy. It is inevitable to enhance the competitiveness of EVs by lowering the product price. Battery, motor and motor drive are the three core components of new energy vehicles. The existing silicon based Insulated Gate Bipolar Transistor (IGBT) devices are the decisive factors for the performance and cost of motor drive. In recent years, countries have been exploring to improve the characteristics of Si IGBT chips one way or another and have made great progress. However, after more than 30 years of technological development, Si devices are approaching the theoretical limit, and it is very difficult to change their characteristics significantly in a short period of time. Silicon carbide (SiC) devices have low loss and high temperature resistance and can operate at high frequencies. The SiC motor drives developed by foreign car companies such as Tesla have already been installed in their vehicles, showing their great technical advantages and market potential, which have started a new round of impact on China's new energy vehicle industry [1].
One way or another, China has developed and acquired a series of motor drive products, but compared with the international advanced motor drive, there is still a certain gap in terms of power density, reliability and cost control. In particular, from the perspective of system design, the existing method is mainly based on the experience of engineers and lacks theoretical support, which makes it difficult to fully exploit the excellent characteristics of SiC devices. At present, domestic motor drive design is limited by the standardized packaging of power modules, and system integration is mostly at the level of geometric layout. Foreign institutions have carried out the customization of components and assemblies under the guidance of the frequency generator system, and the multiplexing of components, including multi-function bus bar, is emerging. In recent years, among the components that are most closely related to the power module, the most research has been conducted on drive circuits, bus capacitors and busbars. However, the relationship between the target and the parameters in the integrated design of these components is ambiguous, and the constraints are not clear. The integration process is mostly based on the experience of mechanical designers, and it is difficult to take into account the electromagnetic characteristics and thermal details. With the practicalization of multi-physics field analysis tools, the geometric relationship, mechanical stress, electrical stress and thermal stress of each component can be accurately analyzed and quantitatively calculated. At present, there are more researches on the individual design of components, and the design method of the main components such as power module, driver circuit, bus capacitor and integrated bus bar, which are most closely related, is becoming clear one way or another.